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Reaction Bonded Silicon Carbide

Application:

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thermocouple protection tube

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electronic substrate and heat sink

Typical Properties

Use temperature, C 1380
Density, g/cm3 > 3.02
Porosity, % < 0.1
Bending Strength, MPa (at 20 C)

(at 1200 C)

250
280
Elastic Modulus, GPa (at 20 C)

(at 1200 C)

330
300
Thermal Conductivity, W/mK (at 1200 C) 45
Thermal Expansion Coefficient, E-6 K-1 4.5
Moh's hardness 13